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One-Piece Screening Mask With Selectively Located Multiple Size Mesh Holes and Open Stencils

IP.com Disclosure Number: IPCOM000036950D
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 2 page(s) / 95K

Publishing Venue

IBM

Related People

Jakubowski, MS: AUTHOR [+4]

Abstract

Screening of printed circuitry onto non-planar surfaces requires a range of material deposition rates. A described mask selectively provides different deposition rates and material shear thinning, as required, to print an image on a substrate surface.

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One-Piece Screening Mask With Selectively Located Multiple Size Mesh Holes and Open Stencils

Screening of printed circuitry onto non-planar surfaces requires a range of material deposition rates. A described mask selectively provides different deposition rates and material shear thinning, as required, to print an image on a substrate surface.

The following describes a one-piece screening mask that has selectively placed mesh holes of customized diameters and open (no mesh) stencil mask cavities. The location and size of the holes is not limited to the mask print example shown in the drawing.

Sheet metal of the required mask thickness is photoresist coated, exposed and etched with a double-sided process. The printing cavity and mesh are concurrently etched from opposite sides, resulting in a one-piece mesh with mesh etched into approximately one half the thickness on the non-active side.

The key to this method is a unique artwork design. This design uses a multiple-size mesh mask design/fabrication. The mesh, non- active artwork has the limited shape of the printed image (active cavity) inset where an open stencil region is required. The mesh hole location and open shape butting edges must be adjusted to ensure individual shape after etch. This artwork will expose the metal mask mesh side so the printed image etches concurrently from both sides in selective locations to result in selective open stencil/mesh mask combination.

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