Browse Prior Art Database

Roll Acid Plate Mechanism

IP.com Disclosure Number: IPCOM000037004D
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 2 page(s) / 53K

Publishing Venue

IBM

Related People

Lee, JL: AUTHOR [+3]

Abstract

Disclosed is a mechanism for continuous copper electroplating of a sheet of KAPTON* which is covered with a thin chromium layer and a seed layer of copper. This mechanism electroplates a copper layer up to 1.4 to 2.0 thousandths of an inch thick.

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Roll Acid Plate Mechanism

Disclosed is a mechanism for continuous copper electroplating of a sheet of KAPTON* which is covered with a thin chromium layer and a seed layer of copper. This mechanism electroplates a copper layer up to 1.4 to 2.0 thousandths of an inch thick.

This mechanism processes a KAPTON continuous sheet through a cleaning step using a solution comprised of sulfuric acid and water, a plating step using a bath comprised of copper sulfate in sulfuric acid with an organic additive such as CUPPRACID** GS818, and a rinsing step made of deionized water. Finally, the sheet is dried with a stream of hot air.

The cleaning step removes copper oxides and any foreign matter collected during the sheet transfer from other manufacturing steps. The electroplating step electroplates copper metal with good mechanical and electrical properties. The thickness of the metal deposit could range from 1.4 to 2.0 thousandths of an inch. The electroplating is conducted using jet streams of acid copper bath.

The stream velocity is adjusted in such a way as to avoid any mass transfer limitations of copper ions depositing onto the sheet surface and to keep the electroplating solution homogeneously stirred. Electrical contact with the sheet surface is made through a drum with moving brush contacts. The rinsing step is achieved with deionized water to remove any traces of electroplating solution. The final step is drying the sheet with streams of hot air. The sheet is then mov...