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High-Density Optical Fiber Arrays for Optoelectronic Devices

IP.com Disclosure Number: IPCOM000037018D
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 2 page(s) / 54K

Publishing Venue

IBM

Related People

Cina, M: AUTHOR [+4]

Abstract

Methods for densely packing fibers on a scale compatible with integrated semiconductor devices are disclosed. The communication-industry standard high-bandwidth optical fibers have core diameters of 50 mmm or 62.5 mm for multi-mode fibers and of N8 mm for mono-mode fibers. Both have an outer (cladding) diameter of 125 mm which limits the density of fibers which can be interfaced with integrated optoelectronic devices. High-density fiber arrays can be fabricated by using optical fibers whose cladding has been partially removed with a suitable etchant, such as buffered hydrofluoric acid. To minimize the coupling (crosstalk) among bundled fibers, a cladding thickness of N10 mm for monomode fibers and N15 mm for multimode fibers, respectively, should be left around the core.

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High-Density Optical Fiber Arrays for Optoelectronic Devices

Methods for densely packing fibers on a scale compatible with integrated semiconductor devices are disclosed. The communication-industry standard high-bandwidth optical fibers have core diameters of 50 mmm or 62.5 mm for multi-mode fibers and of N8 mm for mono-mode fibers. Both have an outer (cladding) diameter of 125 mm which limits the density of fibers which can be interfaced with integrated optoelectronic devices. High-density fiber arrays can be fabricated by using optical fibers whose cladding has been partially removed with a suitable etchant, such as buffered hydrofluoric acid. To minimize the coupling (crosstalk) among bundled fibers, a cladding thickness of N10 mm for monomode fibers and N15 mm for multimode fibers, respectively, should be left around the core. The fiber arrays may be arranged in either linear or two- dimensional formats. The advantage of using etched fibers is illustrated in the figure which displays the calculated packing density for a two-dimensional array of fibers in a square grid as a function of center-to-center spacing between the fibers. Note the solid dot represents the maximum packing density achieved with fibers of the standard size.

Linear Array: Placing the fibers along parallel V- or trapezoidal grooves on a substrate will align them at a controlled spacing. The grooved substrate can be anisotropically etched silicon or precision molded plastic. The packing density for a linear fiber array is 1/d where d is the fiber center-to-center spacing. For such a structure the packing density is...