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Browse Prior Art Database

Heat Sink Assembly Tool

IP.com Disclosure Number: IPCOM000037034D
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 3 page(s) / 133K

Publishing Venue

IBM

Related People

Yakubowski, C: AUTHOR

Abstract

Product components are most vulnerable to contamination during parts handling, especially for the heat sink cooling surface placed in the hat of a thermal conduction module (TCM). Activities that may cause contamination of these functional surfaces must be avoided. This apparatus transfers heat sinks from a holder into the hat with minimized contact and handling. The apparatus also renders ability to personalize the inserts according to the chip population on the substrate. This operation precedes the hat assembly sequence.

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Heat Sink Assembly Tool

Product components are most vulnerable to contamination during parts handling, especially for the heat sink cooling surface placed in the hat of a thermal conduction module (TCM). Activities that may cause contamination of these functional surfaces must be avoided. This apparatus transfers heat sinks from a holder into the hat with minimized contact and handling. The apparatus also renders ability to personalize the inserts according to the chip population on the substrate. This operation precedes the hat assembly sequence.

The assembly tool (Fig. 1) comprises the following major components: programmable template 5 (Fig. 2); heat sink personalizer 10; heat sink holder stage 20; horizontal slide 25; and vertical lift 30.

The heat sink personalizer 10 (Fig. 3) which is a key component of this tool consists of a vacuum chamber 11 and programmable template 5 (Fig. 2). Vacuum shut-off plungers 13 are inserted through the top half 14 of vacuum chamber 11 into vacuum ports in the bottom half 15 of

(Image Omitted)

vacuum chamber 11. "O" rings 16 hold the plungers in the up position when vacuum ports are to be open for pick-up. When plungers are pushed down "O" rings 17 seal plungers closed in vacuum ports, hence preventing vacuum pick- up. Pocket pattern array 18 is machined on the bottom of the vacuum chamber with array dimensions equal to hat array dimensions.

General description of the heat sink personalization and transfer operation is as foll...