Browse Prior Art Database

Removable Module Heat Sink for Inspection and Rework

IP.com Disclosure Number: IPCOM000037101D
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 2 page(s) / 30K

Publishing Venue

IBM

Related People

Kryzaniwsky, BR: AUTHOR [+3]

Abstract

Disclosed is a method that makes it possible for the inspection and rework of a module that contains one or more overhanging members such as a heat sink.

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Removable Module Heat Sink for Inspection and Rework

Disclosed is a method that makes it possible for the inspection and rework of a module that contains one or more overhanging members such as a heat sink.

The increasingly higher powers for air-cooled logic modules in surface mount technology (SMT) has made it necessary to use attached heat sinks that are optimized for their particular application. As an example, the module/heat sink assembly shown in the figures has overhanging members to increase the total surface area of the heat sink and thus provide better cooling. Fig. 1 is a side view, and Fig. 2 is a top view. Use of overhanging members, however, makes SMT assembly and rework almost impossible. In addition, the module cap and heat sink are conventionally either a one-piece integral part or are epoxied together.

To enhance thermal performance and also meet the SMT assembly and rework requirements, it is necessary that the heat sink be mounted after SMT assembly of the module and be easily removed during rework operation of the module. Low temperature solder can be used to attach the sink to the cap. Solder has a higher thermal conductivity than epoxy and thus the interface resistance between the heat sink and module cap will be reduced. To allow uniform air heating and, thus, easy removal of the sink, slots may be cut in the heat sink base (see the figures).

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