Browse Prior Art Database

ZIF Interposer Board for TCM to Clark or Other Similar Applications

IP.com Disclosure Number: IPCOM000037130D
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 2 page(s) / 70K

Publishing Venue

IBM

Related People

Grebe, KR: AUTHOR [+3]

Abstract

Disclosed is an interposer which acts as a zero insertion force (ZIF) connector between a thermal conduction module (TCM) and Clark Board, allowing the contacts to be placed on a .012 X .030 inch matrix. The design allows the connections to be made in an environment that would not normally be conducive with mating flat surfaces.

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ZIF Interposer Board for TCM to Clark or Other Similar Applications

Disclosed is an interposer which acts as a zero insertion force (ZIF) connector between a thermal conduction module (TCM) and Clark Board, allowing the contacts to be placed on a .012 X .030 inch matrix. The design allows the connections to be made in an environment that would not normally be conducive with mating flat surfaces.

The primary concept of this connector consists of one or more turns of a coil spring which is loosely held captive and in a vertical position. The very nature of a coil spring subjected to a force perpendicular to the coil formation will allow the coil diameter to reduce. As the diameter reduces, the wiping action to insure clean contact area will naturally occur.

A matrix of these connectors can be fabricated by anisotropic etching of (110) silicon to be used as one half of an insulating shell. By joining two halves of this silicon shell using known techniques such as field assisted bonding or the reflowed Schott glass approach and capturing individual springs, a ZIF connector is formed as shown in Fig. 1. The dimensions for the silicon thickness, as shown in Fig. 2, are .008-inch thick which will yield an interposer thickness of .016

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inch when the two halves are joined. The .016-inch diameter gold- plated phosphor/bronze spring will protrude by .002 inch on either side of the interposer prior to compression. The spacing of contacts is .030 inch in the X...