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Tertiary Amine Resin Flux Activator

IP.com Disclosure Number: IPCOM000037139D
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Schuessler, P: AUTHOR

Abstract

Rosin based solder fluxes as used in the electronics industry are often formulated with surfactants, activators, solvents, etc. Often times these additives react with each other or with the flux matrix during soldering to leave residues.

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Tertiary Amine Resin Flux Activator

Rosin based solder fluxes as used in the electronics industry are often formulated with surfactants, activators, solvents, etc. Often times these additives react with each other or with the flux matrix during soldering to leave residues.

The use of a tertiary amine to act as the sole additive has yielded improved solder wetting. Specifically, N'N'N'N' - tetrakis - (2- hydroxypropyl) ethylenediamine, when used between 0.5 and 2% by weight, improves solder wetting by over 20% of the wet-out achieved with a similar (unactivated) R-type flux. After flux removal, no visual residues were discernable as fewer additives were used that could have interacted.

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