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Multi-Row Photoresist Lamination for Thin Film Dimensional Stability

IP.com Disclosure Number: IPCOM000037283D
Original Publication Date: 1989-Dec-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Darrow, RE: AUTHOR [+4]

Abstract

Disclosed is a process which significantly reduces the dimensional stability problems introduced by lamination dry film resist systems to thin film materials (both in roll and panel formats).

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Multi-Row Photoresist Lamination for Thin Film Dimensional Stability

Disclosed is a process which significantly reduces the dimensional stability problems introduced by lamination dry film resist systems to thin film materials (both in roll and panel formats).

Thin film products face a unique challenge with respect to maintaining dimensional stability control following dry film resist application. Due to the extreme "thinness" of the base KAPTON* material (2-5 mils), the resist system (3-5 mils total thickness with protective carrier) greatly influences the overall dimensional stability of the resist clad product. The thin film build format incorporating numerous narrow product strips (35 mm or greater) in multiple rows across a continuous panel/roll width (7 inches and greater) highlights the need for a tightly controlled, dimensionally stable process through resist lamination. Industry direction for resist film lamination, however, has primarily focused on much thicker, more dimensionally stable card/board applications. As a result, the dimensional stresses imparted to the product by the resist system have gone largely unnoticed and unaddressed.

By sectioning the resist web from one continuous width into multiple narrower rows just prior to lamination (see the figure), the accumulated stresses induced across the product width by the resist web are significantly reduced. This multi- row technique may be performed either by slitting a full width resist film just...