Browse Prior Art Database

Selective Molten Solder Applicator for Arrays

IP.com Disclosure Number: IPCOM000037285D
Original Publication Date: 1989-Dec-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 2 page(s) / 55K

Publishing Venue

IBM

Related People

Apap, J: AUTHOR [+7]

Abstract

Disclosed is a method to transfer molten solder to an array of separate, tightly spaced solderable surfaces. This method will deposit a controlled volume of solder on each separate solderable surface without causing "bridging" (solder connection, not by design, between two separate electrically isolated solderable surfaces).

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Selective Molten Solder Applicator for Arrays

Disclosed is a method to transfer molten solder to an array of separate, tightly spaced solderable surfaces. This method will deposit a controlled volume of solder on each separate solderable surface without causing "bridging" (solder connection, not by design, between two separate electrically isolated solderable surfaces).

An array of "soldering iron tips" mounted on a solid block is used to transfer the molten solder. The array is of the same pattern as the separate solderable surfaces. The solid block is heated to the applicable soldering temperature by an external source. The solid block and the soldering tips are made of copper. (See Fig. 1.)

The volume of solder is controlled by the size of the cavity located at the contact end of the soldering tip (see Fig. 2). The surface of solid block and the surface of the soldering tip from the solid block to the contact end of the tip are covered with a high temperature coating that prevents solder wetting.

A solder wave is used as both the source of clean oxide-free solder and as the method of cleaning dross from the soldering tips.

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