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Via Punching Device for Multi-Layered Ceramic Substrates

IP.com Disclosure Number: IPCOM000037316D
Original Publication Date: 1989-Dec-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 3 page(s) / 44K

Publishing Venue

IBM

Related People

Shumate, JR: AUTHOR [+2]

Abstract

A technique is described whereby the mechanical punching of via holes in multi-layered ceramic substrates is controlled through the use of six independently controlled punching stations. The new via punching system is an improvement of a previous system which uses only a single die set station to produce the via holes.

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Via Punching Device for Multi-Layered Ceramic Substrates

A technique is described whereby the mechanical punching of via holes in multi-layered ceramic substrates is controlled through the use of six independently controlled punching stations. The new via punching system is an improvement of a previous system which uses only a single die set station to produce the via holes.

Described is a mechanical via punching device which uses six punching stations instead of one. It is designed to increase speed and accuracy of via hole production and to reduce wear on the mechanism, since fewer parts are used, as compared with the previous punching mechanism.

In the prior-art of producing via holes in multi-layered ceramic substrates, the punching machine used three primary workstations. At the first station, four holes were punched at each corner of a substrate sheet to be used to locate the sheet at subsequent workstations. At the second station, the via holes were punched using a single die set. The final station included the verification step.

The prior-art machine utilized a single die set to punch all of the via holes on a sheet. Each die set was populated with a fixed array of punches laid out to match a certain product type. An array might include from 4 to 144 punches. The dies could be programmable so that the number of holes produced with each die stroke could be controlled. Although this increased the number of patterns that could be produced with a single die set, production suffered since not all punches were producing holes with each die stroke. As the complexity of the via hole pattern increased, the average number of via holes produced per stroke would decrease. This would result in an overall production decrease.

Also, in the prior-art punching machine, each workstation had its own sheet fixture which required a separate mechanism for transporting the substrates between stations. This required the die to be opened while the substrate was placed onto its fixture, again requiring additional mechanisms.

The concept described herein improves on the punching of vias in multi- layered substrates by providing six independently controlled via punching stations with a die set at each punching station comprised of only a single row of punches. The six independent punching stations allow the total punching work to be divided into smaller work units so that operations can be performed simultaneously. The operations enable the via patterns to be punched sequentially in six equal areas, but all six dies are punching simultaneously on six different substrates.

The mechanism consists of six independently controlled via punching workstations where each punching station would punch a single row of punches on a single sheet. Six substrates can be punched simultaneously, one at each workstation. The substrate carrier is used to grip the substrate along one of its edges. This enables the carrier to be positioned at each of the six workstations ...