Browse Prior Art Database

Insert Layer for Surface Mount Components

IP.com Disclosure Number: IPCOM000037424D
Original Publication Date: 1989-Jan-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Kang, SK: AUTHOR [+2]

Abstract

During thermal cycling, there is risk of failure of the solder joints for a surface mounted pinned component as shown in Fig. 1. The failure is due to large displacements, caused by a mismatch in the thermal expansion coefficient between the card and the module, at the corner solder joints.

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Insert Layer for Surface Mount Components

During thermal cycling, there is risk of failure of the solder joints for a surface mounted pinned component as shown in Fig. 1. The failure is due to large displacements, caused by a mismatch in the thermal expansion coefficient between the card and the module, at the corner solder joints.

When placed as indicated in the figure, an insert layer, made out of the same material as the card and having a hole configuration which corresponds to the pins, minimizes the displacement damage and controls the solder configuration during reflow.

Disclosed anonymously.

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