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Large Holes for Through Circuit Board Connections

IP.com Disclosure Number: IPCOM000037428D
Original Publication Date: 1989-Jan-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Leslie, GG: AUTHOR [+4]

Abstract

This permits injection molded circuit boards to be fabricated without costly through vias. The board is made by injection molding with inserts or the mold itself defining large holes and edge indentions. Through connections are made by leads plated across the edge of these large openings, each having several, separate leads.

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Large Holes for Through Circuit Board Connections

This permits injection molded circuit boards to be fabricated without costly through vias. The board is made by injection molding with inserts or the mold itself defining large holes and edge indentions. Through connections are made by leads plated across the edge of these large openings, each having several, separate leads.

Fig. 1 is a perspective view of such a circuit board, with a large hole 1 and a large notch or indention 3. Each accommodates three leads 5 which connect one side of the board to the other and thereby eliminate individual via holes for each through connection. The leads 5 can be on fine pitch centers of 0.025 inch or less.

Because of the elimination of individual vias, the cost of this card can be very low. It is equally useful for surface mount components or chip on board components. Fig. 2 shows a illustrative circuit board with components 9 employing two holes 1 and one notch 3 for interconnection to the opposite side of the board.

Disclosed anonymously.

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