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Ultra High Vacuum Wafer Shutter

IP.com Disclosure Number: IPCOM000037444D
Original Publication Date: 1989-Jan-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Deurr, FW: AUTHOR [+4]

Abstract

A technique is described whereby an ultra high vacuum wafer shutter is implemented in a process chamber, during a semiconductor fabrication process, to cover process wafers, so as to eliminate the need for double pumped O-ring seals and expensive ferro-fluidic feedthru components.

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Ultra High Vacuum Wafer Shutter

A technique is described whereby an ultra high vacuum wafer shutter is implemented in a process chamber, during a semiconductor fabrication process, to cover process wafers, so as to eliminate the need for double pumped O-ring seals and expensive ferro-fluidic feedthru components.

The concept makes use of a bellows sealing component shaft/curved slot design to provide the proper positioning to cover a wafer in the fabrication process vacuum chamber. Shaft 5, as shown in the Figure, rotates and moves linearly through curved slot 8, so as to enable a wafer to be covered or uncovered by shutter 6, during a thin film fabrication process. The combination of rotate plus linear motion is achieved with a single shaft 5, whereby pin 7 in shaft 5, moves curved slot 8 up and down to produce the up and down movement as well as rotary motion. The angle of motion is determined by the distance shutter cover 6 has to move to clear the wafer and cathode area in the process vacuum chamber. This angle of motion can easily be changed for different shutter system geometries.

Bellows 2, attached to housing 3, provides the required vacuum seal. Sealing flange 4 to attach this shutter mechanism to an existing vacuum chamber can be O-ring or metal conflat seals. The shutter's up and down motion is governed by air cylinder 1, operated by less than 80 psi of air pressure. An electronic process control system, external to the fabrication process vacuum chambe...