Browse Prior Art Database

Hot Air Thermode

IP.com Disclosure Number: IPCOM000037457D
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Hall, DA: AUTHOR [+3]

Abstract

A device for heating a gas used for the flow of solder around leads of tape automated bonding (TAB) devices has been designed and tested. Significant features include (1) two jackets, external to the heater, which utilize previously wasted heat for preheating incoming gas; (2) multipass gas flow that provides additional surface area for enhanced heat transfer; (3) band heating applied to the heater outer diameter, providing uniform heat flux; and (4) sufficient heater mass and specific heat for maintenance of uniform gas temperature with a minimum of heater power control.

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Hot Air Thermode

A device for heating a gas used for the flow of solder around leads of tape automated bonding (TAB) devices has been designed and tested. Significant features include (1) two jackets, external to the heater, which utilize previously wasted heat for preheating incoming gas; (2) multipass gas flow that provides additional surface area for enhanced heat transfer; (3) band heating applied to the heater outer diameter, providing uniform heat flux; and (4) sufficient heater mass and specific heat for maintenance of uniform gas temperature with a minimum of heater power control.

Figure 1 illustrates the jackets (A) that preheat incoming pressurized gas (B) prior to its flow through passages (C) guided by grooves (D) in encaps (E) attached to heater core (F) heated by band heater (G). The heated gas exits nozzle (H).

Initial testing indicates that the requisite gas temperature can be achieved with a heater core temperature of 300 deg. C using 250 Watts. The heater replaced by this invention produced an excessive core temperature of 650 deg. C and required 600 Watts to achieve desired gas temperature.

Disclosed anonymously.

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