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Solder Flux Used As Adhesive Holding Component to Board Eliminates Clinching

IP.com Disclosure Number: IPCOM000037465D
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Cooper, SA: AUTHOR [+2]

Abstract

A small amount of solder flux, of the proper viscosity, placed on component leads just prior to insertion into holes in the circuit board, acts as an adhesive to hold the component in place during the subsequent soldering operation. This eliminates the need for a clinching operation.

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Solder Flux Used As Adhesive Holding Component to Board Eliminates Clinching

A small amount of solder flux, of the proper viscosity, placed on component leads just prior to insertion into holes in the circuit board, acts as an adhesive to hold the component in place during the subsequent soldering operation. This eliminates the need for a clinching operation.

In the present embodiment, as the component is picked up by the assembly robot, the leads are touched to a dispenser of water soluble solder flux and then inserted into the card. The amount of flux dispensed is adequate to surround the lead on the surface of the board and hold the component in place through the solder process. The flux is compatible with the normal post solder rinse process.

The time required for the robot to perform this task is much less than the time required to clinch the leads.

Disclosed anonymously.

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