Browse Prior Art Database

Bifurcated Warp Chuck

IP.com Disclosure Number: IPCOM000037484D
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Gardineer, B: AUTHOR [+2]

Abstract

The focussing stage of wafer process tools requires precise minute motions which must be free from any tilt or angular variations which would lead to lateral displacements and loss of focussing accuracy. These variations can be eliminated by using compound metal diaphragms to move and support the wafer chuck support plate during the focussing motion.

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Bifurcated Warp Chuck

The focussing stage of wafer process tools requires precise minute motions which must be free from any tilt or angular variations which would lead to lateral displacements and loss of focussing accuracy. These variations can be eliminated by using compound metal diaphragms to move and support the wafer chuck support plate during the focussing motion.

In the Figure, onto a baseplate 1 are mounted lower 2 and upper 3 diaphragms and a chuck mounting plate 6. The diaphragms 2 and 3 are attached to each other by rigid mounting around their periphery and at a center annulus. The lower diaphragm 2 is separated from the base plate 1 by an air chamber 4 which is sealed to said base place by an o-ring 5.

In operation, air under pressure is introduced into the chamber 4 which causes the lower diaphragm 2 and the upper diaphragm 3 to flex and thus move away from the base plate 1. As the diaphragms are fixed to each other at their periphery and their centers and thus cannot move laterally in relation to each other or the base plate, the wafer chuck plate 6 is translated perpendicularly without loss of parallelism.

Disclosed anonymously.

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