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Thermally Conductive Electrical Isolation Wafer

IP.com Disclosure Number: IPCOM000037485D
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Pavelka, JB: AUTHOR

Abstract

It is proposed to use a ceramic wafer to provide electrical isolation to electronic cooling systems. One side of the wafer is polished and the other is metallized. A solder or braze joint is used to join the wafer to the cooling device.

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Thermally Conductive Electrical Isolation Wafer

It is proposed to use a ceramic wafer to provide electrical isolation to electronic cooling systems. One side of the wafer is polished and the other is metallized. A solder or braze joint is used to join the wafer to the cooling device.

In conventional cooling systems that use a piston in hat approach, one or both components are made of aluminum. The aluminum is anodized to provide electrical isolation. Use of the ceramic wafer for isolation would allow both the piston and hat to be made of alternate metals of higher conductivity. This would result in improved thermal performance compared to systems that use aluminum cooling components.

Referring to the Figures, the proposal suggests using a ceramic wafer 1 made out of aluminum nitride or beryllium oxide. One side of the wafer has a metallized upper surface 2 and the other a polished face 3. The wafer would be joined to the metal cooling device 4 by connecting means 5 of soldering or brazing. The polished face 3 makes firm contact with a circuit chip 6 when the cooling device is in operation.

The proposed wafer has a low thermal resistance and provides reliable electrical isolation. The polished face is resistant to marring and scratching which would reduce thermal performance.

Disclosed anonymously.

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