Browse Prior Art Database

Improved Substrate Bonding

IP.com Disclosure Number: IPCOM000037506D
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Chu, MC: AUTHOR [+5]

Abstract

Disclosed is an approach for hot pressing two electronic structures together using a 3-component adhesive system which (1) fills the fine spaces between active electronic components in the structures during hot pressing and (2) possesses sufficient thickness uniformity required by optimal electrical performance after hot pressing.

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Improved Substrate Bonding

Disclosed is an approach for hot pressing two electronic structures together using a 3-component adhesive system which (1) fills the fine spaces between active electronic components in the structures during hot pressing and (2) possesses sufficient thickness uniformity required by optimal electrical performance after hot pressing.

An ideal 3-component adhesive system is an adhesive/core/adhesive structure consisting of adhesives with good flow properties and adhesion to the core and substrates, and a core layer whose thickness is uniform and not changed by hot pressing conditions. Depending on the dielectric requirements, the core material can be an insulator or a metal. An example of the adhesive system is the Thermid*/Kapton**/Thermid system. Lamination of electronic structures with the adhesive system may consist of a sample drying step and a vacuum lamination step.

References * Trademark of National Starch and Chemical Co. ** Trademark of E. I. du Pont de Nemours & Co.

Disclosed anonymously.

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