Browse Prior Art Database

Thermoelectric Temperature Cycler for Chip Functional Testing

IP.com Disclosure Number: IPCOM000037540D
Original Publication Date: 1989-Mar-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Walker, JR: AUTHOR

Abstract

This article discloses the use of a Peltier device (thermoelectric heater/cooler) as a means for temperature cycling a test chip to elevated temperatures of up to 125 degrees centigrade for design evaluation and verification.

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Thermoelectric Temperature Cycler for Chip Functional Testing

This article discloses the use of a Peltier device (thermoelectric heater/cooler) as a means for temperature cycling a test chip to elevated temperatures of up to 125 degrees centigrade for design evaluation and verification.

Referring to the figure, a chip 10 under test has its protective cover removed, which allows for the Peltier assembly 11 to be placed onto the chip's surface. The assembly includes an altered protective cover 12, copper heat sink 14, and Peltier device 16 which is placed over the ceramic chip carrier 18 and directly onto the chip 10.

Thermal transfer to the chip surface is accomplished by adding a thermal transfer agent, such as a silicon compound at point A. Electrical isolation of the chip 10 from the assembly 11 is achieved by the utilization of a ceramic substrate surface that is an integral part of the Peltier device.

Actual control of the assembly is by means of a thermocouple placed at point A on the surface of the chip 10 or on the Peltier device's heating surface. The current developed at the thermocouple junction is fed into a current to voltage amplifier and then to a current controlled DC power supply that uses a preset temperature reference voltage set point that allows a pulsating control current to be applied to the Peltier assembly. Control of temperatures to 125 degrees centigrade can be achieved in this fashion by using the thermocouple feedback vs. reference vol...