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Thin Film Coating Technique

IP.com Disclosure Number: IPCOM000037575D
Original Publication Date: 1989-Mar-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Feder, R: AUTHOR [+3]

Abstract

Thin films can be deposited with uniform thickness in vacuum chambers having diameters not much larger than the diameter of the substrate being coated by using atomic and molecular reflection from the chamber sidewall to enhance the deposition rate near the outside edge of the work piece.

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Thin Film Coating Technique

Thin films can be deposited with uniform thickness in vacuum chambers having diameters not much larger than the diameter of the substrate being coated by using atomic and molecular reflection from the chamber sidewall to enhance the deposition rate near the outside edge of the work piece.

In the figure, substrate 1 being coated is rotatably supported near the top of vacuum chamber 2. Source 3, such as an electron beam evaporator, is separated from the target by baffle 4 with opening 5 and positioned at about one quarter of the distance to substrate 1. The baffle shadows the lower approximate two thirds of the chamber. A shutter 6 and quartz monitor 7 are provided. Sources 8 and x-ray counter 9 are used to detect reflectivity during deposition and prevent accumulation of thickness errors.

Coating results from both direct and indirect deposition. The material deposited affects the ratio with the lighter elements producing the higher indirect rates. The ratio of direct to indirect deposition can be modified by chamber wall smoothness, a baffle or a shutter. Smooth walls and tall, narrow chambers tend to increase the indirect deposition, as does partial shuttering, while inserted baffles reduce the indirect rate. Optimum depositions are best determined empirically.

Disclosed anonymously.

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