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Thin Film Splicing

IP.com Disclosure Number: IPCOM000037607D
Original Publication Date: 1989-Apr-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Lord, KC: AUTHOR [+2]

Abstract

Improved mechanical bonding and electrical continuity is obtained between strips of thin metal film by splicing the strips with copper preforms coated with gold/tin solder and flux.

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Thin Film Splicing

Improved mechanical bonding and electrical continuity is obtained between strips of thin metal film by splicing the strips with copper preforms coated with gold/tin solder and flux.

Referring to the figure, copper preforms 1, 2 are given a coat of gold/tin solder and dried flux on one surface and one preform is placed with coated side up on fixture 3 with pins 4. Edge perforated strips 5, 6 of thin metal film, usually copper, are butted together and placed over preform 1 and pins 4. Second preform 2 is placed over the joint with its coated side down, and sufficient heat is applied from duct 7 to reflow the solder. The soldering process forms a metallurgically sound joint with excellent electrical continuity. The gold/tin solder avoids contamination of subsequent plating baths when the joined strips are plated.

Disclosed anonymously.

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