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Circuit Repair by Electropolymerization of a Conductive Polymer

IP.com Disclosure Number: IPCOM000037625D
Original Publication Date: 1989-Apr-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Buchwalter, SL: AUTHOR [+2]

Abstract

A method of repairing electrical opens in metal circuitry is disclosed. The method makes use of the known tendency of certain organic compounds to polymerize at the anode of an electrochemical cell.1

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Circuit Repair by Electropolymerization of a Conductive Polymer

A method of repairing electrical opens in metal circuitry is disclosed. The method makes use of the known tendency of certain organic compounds to polymerize at the anode of an electrochemical cell.1

Compounds such as aniline, thiophene, pyrrole, furan and other aromatic and heteroaromatic species undergo an electropolymerization at various electrode potentials. The anodic electropolymerization has been shown to result in an oxidized polymer somewhat similar to that obtained by oxidizing or p-doping poly(acetylene). Conductivities as high as 500 S/cm have been obtained with, for example, poly(thiophene).2 The polymer is normally grown as a film on the electrode surface.

In order to use these materials for circuit repair, it is only necessary to connect the metal lines to be repaired to a power supply and expose them to a droplet of solution containing the monomer and a supporting electrolyte. The counterelectrode, e.g., a platinum wire, can be contained in the droplet as well by threading it through the capillary tube supporting the droplet. Under the oxidizing potential applied to the metal lines, the polymer film is deposited, eventually bridging the gap. The polymer is deposited in the oxidized, conductive form so that, except for a rinse to remove traces of the solution, the repair is complete.

References: 1. G. P. Kittlesen, H. S. White, and M. S. Wrighton, J. Amer. Chem. Soc., 106, 7389 (1984);...