Browse Prior Art Database

LCD VLSI Package

IP.com Disclosure Number: IPCOM000037635D
Original Publication Date: 1989-Apr-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Horton, RR: AUTHOR [+5]

Abstract

Large screen Liquid Crystal Displays or LCD's for use in PC's, office workstations, or computer terminals require VLSI chip packaging to enable electrical control of the individual picture elements. Such elements form an array, with individual cells placed on a fine pitch. One technique that is used to bring digital information from the control circuits to the picture elements is to use flexible cables. This solution is not compact and requires the use of bulky cable connectors.

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LCD VLSI Package

Large screen Liquid Crystal Displays or LCD's for use in PC's, office workstations, or computer terminals require VLSI chip packaging to enable electrical control of the individual picture elements. Such elements form an array, with individual cells placed on a fine pitch. One technique that is used to bring digital information from the control circuits to the picture elements is to use flexible cables. This solution is not compact and requires the use of bulky cable connectors.

The solution to the problem is to place the control chips directly on the glass substrate of the LCD screen. However, conventional packaging SMT techniques will not be compatible with the density of lines required, nor is wirebonding compatible with the thin film, metallurgy of the LCD. Our solution is to use the metallurgy of the LCD to form pads for the attachment of TAB- mounted high-I/O control chips. The TAB leads are attached by soldering, typically, by means of Pb/Sn eutectic soldering of the TAB leads to the pads on the LCD substrate. In order to make this possible, the top level of metal used in the manufacture of the LCD is one which is compatible with soldering. This metal may be copper, gold, nickel or the like.

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