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Jogged Circuit Repair Technique

IP.com Disclosure Number: IPCOM000037671D
Original Publication Date: 1989-May-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Houser, DE: AUTHOR [+2]

Abstract

Printed circuit board/card manufacturing is becoming more complex due to increased circuit line density. This trend places a considerable challenge on the techniques to repair jogged circuit line opens. Presently, circuit opens are repaired with a brazing process, using a flattened copper ribbon as the repair material. This process is severely limited on jogged circuit opens.

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Jogged Circuit Repair Technique

Printed circuit board/card manufacturing is becoming more complex due to increased circuit line density. This trend places a considerable challenge on the techniques to repair jogged circuit line opens. Presently, circuit opens are repaired with a brazing process, using a flattened copper ribbon as the repair material. This process is severely limited on jogged circuit opens.

Disclosed is a technique to repair a circuit open occurring on the jogged line section of a printed circuit. It utilizes a current piece of braze process equipment with modifications made to the repair wire feed mechanism. In addition, a round copper wire is substituted for the current repair material, the flattened copper ribbon. This is due to the round wire's symmetric longitudinal bending axis. The braze process equipment modification are described in the following.

To allow for bending of the repair wire, modifications to the wire feed mechanism 1 are made as shown in the illustration. A linear ball-bearing slide 2 is mounted between the wire feed mechanism 1 and the extension beam 3, allowing for linear motion of the wire feed mechanisms 1 orthogonal to the printed circuit 4. A lead screw 5 threaded through a lead screw bracket 6, as well as an extension spring 7, are added to provide position control of the slide 2.

Disclosed anonymously

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