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Interconnection of Metal Films On Opposite Sides of a Printed Circuit Board

IP.com Disclosure Number: IPCOM000037673D
Original Publication Date: 1989-May-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Bhan, AK: AUTHOR [+3]

Abstract

In conventional practice, the metallurgy on opposite sides of a printed circuit board has usually been connected by plating vias which extend through the board from one side to the other. Plating has several manufacturing drawbacks, and the present technique provides the electrical connection without plating.

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Interconnection of Metal Films On Opposite Sides of a Printed Circuit Board

In conventional practice, the metallurgy on opposite sides of a printed circuit board has usually been connected by plating vias which extend through the board from one side to the other. Plating has several manufacturing drawbacks, and the present technique provides the electrical connection without plating.

The single figure shows a printed circuit board 10 which has metal coatings 12 and 14 on opposite sides thereof. Each via 16 extends through the board 10 from one side to the other. Metal inserts 18 which as shown in the figure are prongs of a p-dip component such as a resistor extend through the board. On one side the prong is soldered to the metal 12 by solder paste and reflow solder connection 20 and the other side is connected by a wave soldered connection
22. The solder connection 20 and 22 together with the metal inserts 18 constitute an electrical connection between the metal coatings 12 and 14 on opposite sides of the board 10.

Disclosed anonymously.

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