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Xerographic Wafer Mapping Procedure

IP.com Disclosure Number: IPCOM000037676D
Original Publication Date: 1989-May-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Fredericks, EC: AUTHOR [+2]

Abstract

This article discloses a novel method of wafer mapping, which involves the use of xerographic reproduction equipment and polymeric films. Normally, wafer mapping is achieved by photographing a whole wafer containing processed chips. Xerographic copying a processed wafer, however, shows no chip placement detail at all. Placing a polymeric film of polyethylene, polypropylene polymer or copolymers thereof between the processed wafer and the incident xerographic light exposure permits accurate wafer mapping detail to be seen and saved in an inexpensive, rapid, xerographic copy for further evaluation.

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Xerographic Wafer Mapping Procedure

This article discloses a novel method of wafer mapping, which involves the use of xerographic reproduction equipment and polymeric films. Normally, wafer mapping is achieved by photographing a whole wafer containing processed chips. Xerographic copying a processed wafer, however, shows no chip placement detail at all. Placing a polymeric film of polyethylene, polypropylene polymer or copolymers thereof between the processed wafer and the incident xerographic light exposure permits accurate wafer mapping detail to be seen and saved in an inexpensive, rapid, xerographic copy for further evaluation.

Disclosed anonymously.

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