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Circuit Module with Array of Semiconductor Chips Thermal Resistances Distributed in Pattern to Prevent Overcooling in the Edges of the Array

IP.com Disclosure Number: IPCOM000037696D
Original Publication Date: 1989-May-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Edwards, DL: AUTHOR [+2]

Abstract

Some circuit modules have a flat chip carrier, chips mounted in an array on the chip carrier, a water cooled cold plate, and a structure called a hat that provides thermal conduction from the chips to the cold plate. The hat includes cooling inserts that contact the chip and are slidably located in the hat to adjust to differences of vertical position of the associated chip above the chip carrier. The chips operate at differing power levels and the cooling structure is designed to adequately cool the chip with the highest power. To prevent overcooling lower power chips, additional thermal resistance is designed into their heat transfer paths. Many techniques for creating this resistance are known: for example the cooling inserts can be designed smaller or made of a material of low thermal conductivity.

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Circuit Module with Array of Semiconductor Chips Thermal Resistances Distributed in Pattern to Prevent Overcooling in the Edges of the Array

Some circuit modules have a flat chip carrier, chips mounted in an array on the chip carrier, a water cooled cold plate, and a structure called a hat that provides thermal conduction from the chips to the cold plate. The hat includes cooling inserts that contact the chip and are slidably located in the hat to adjust to differences of vertical position of the associated chip above the chip carrier. The chips operate at differing power levels and the cooling structure is designed to adequately cool the chip with the highest power. To prevent overcooling lower power chips, additional thermal resistance is designed into their heat transfer paths. Many techniques for creating this resistance are known: for example the cooling inserts can be designed smaller or made of a material of low thermal conductivity.

Various effects can cause the cooling to be distributed unevenly with respect to the cooling inserts. For example, if the cold plate extends beyond the edges of the hat it provides more cooling for the chips at the edges of the array. In this module, thermal resistances are added in a pattern that compensates for this uneven cooling effect, preferably without regard to the differences in heat produced by chips at different locations in the array. In a module with more cooling toward the edges, a relatively high resistance can...