Browse Prior Art Database

Benzotriazole Process Optimization And Improvement

IP.com Disclosure Number: IPCOM000037722D
Original Publication Date: 1989-Jun-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Fellows, C: AUTHOR [+3]

Abstract

The development of a printed circuit board or the like typically involves the pumice scrubbing of a peel-apart copper layer. After the pumice scrub operation, a Benzotriazole (BTA) layer is applied to the copper surface after a series of steps are taken to prepare the copper surface. This series of steps is simplified by the combination of pumice scrub and Cu2O formation, thus eliminating several wet processes prior to BTA application. Solid NaHCO3 replaces the pumice as the abrasive and erodes the peaks of the copper, thereby smoothing the surface while at the same time forming the Cu2O required for the formation of a uniform BTA layer.

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Benzotriazole Process Optimization And Improvement

The development of a printed circuit board or the like typically involves the pumice scrubbing of a peel-apart copper layer. After the pumice scrub operation, a Benzotriazole (BTA) layer is applied to the copper surface after a series of steps are taken to prepare the copper surface. This series of steps is simplified by the combination of pumice scrub and Cu2O formation, thus eliminating several wet processes prior to BTA application. Solid NaHCO3 replaces the pumice as the abrasive and erodes the peaks of the copper, thereby smoothing the surface while at the same time forming the Cu2O required for the formation of a uniform BTA layer.

Disclosed anonymously.

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