Browse Prior Art Database

Process for Sealing "C" Pins in a Surface Mount Array

IP.com Disclosure Number: IPCOM000037727D
Original Publication Date: 1989-Jun-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Baggett, BL: AUTHOR [+2]

Abstract

The present process is particularly useful when used in conjunction with an edge sealing process for surface mount array "C" pin design modules because it provides a hermetically sealed module package which can withstand module processing, thermal chip shock and mechanical impact shock. The process provides an AIP-13 15% solid pin sealant which is an amide-imide co-polymer solution in n-methyl pyrrolidone with the following composition: Amoco "AI-10" powder 14.3 wt. % Union Carbide "A1100" Silane 0.7 wt. % N-methyl pyrrolidone 85.0 wt. %

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 95% of the total text.

Page 1 of 1

Process for Sealing "C" Pins in a Surface Mount Array

The present process is particularly useful when used in conjunction with an edge sealing process for surface mount array "C" pin design modules because it provides a hermetically sealed module package which can withstand module processing, thermal chip shock and mechanical impact shock. The process provides an AIP-13 15% solid pin sealant which is an amide-imide co-polymer solution in n-methyl pyrrolidone with the following composition: Amoco "AI-10" powder 14.3 wt. % Union Carbide "A1100" Silane 0.7 wt. % N-methyl pyrrolidone 85.0 wt. %

The process uses a shot size of 300mg on a 28mm square module. The solution is dried at a temperature between 60o to 85o until visibly dry. A three stage cure cycle follows: 110oC for 1 hour, 150oC for 1 hour and 180oC for 3 hours.

An advantage of dispensing on the pin head side is there is no danger of filleting the "C" pin. This fillet would have a potential detriment to the thermal cycling life of the "C" pin-card joint.

A disadvantage of dispensing on the pin head side is the danger of filleting the semiconductor device with the cured polymer and potentially degrading its thermal fatigue life. This is especially true when there is a pin in close proximity to the device. However, this problem can be overcome by dispensing a small amount of a material (such as a silicone gel) under and around the device which may not be wetted by the "AIP-13" solution. (This gel does not aff...