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Module Heat Shield for High Temperature Soldering

IP.com Disclosure Number: IPCOM000037728D
Original Publication Date: 1989-Jun-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Hillis, L: AUTHOR [+4]

Abstract

The sensitivity of some types of modules to the high temperatures of vapor phase soldering, and the like, can be overcome by the use of heat shields. These heat shields will insulate such heat-sensitive modules quite effectively during the vapor phase soldering step of the assembly process.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

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Module Heat Shield for High Temperature Soldering

The sensitivity of some types of modules to the high temperatures of vapor phase soldering, and the like, can be overcome by the use of heat shields. These heat shields will insulate such heat-sensitive modules quite effectively during the vapor phase soldering step of the assembly process.

Such heat shields with Teflon and silicone rubber are unusually effective. Both the Teflon and the silicone act as heat insulators, while the silicone rubber, in the arrangement shown in FIG.1, serves as a sealant to keep various vapors from the module.

The structure for a heat shield shown in FIG. 1. has been tested and found to reduce the temperature of a test module from 210oC to 150oC during one (1) minute of vapor phase reflow exposure. The use of a gasket to provide a seal is an important function in this form of the heat shield.

A modification of the structure for the heat shield is shown in FIG. 2. In this arrangement, the molded silicone rubber functions as a more flexible structure while shielding a test module effectively from the high temperatures of reflow soldering.

The configuration of a heat shield can vary and can be formed to fit various modules.

Disclosed anonymously.

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