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Optical System for Monitoring Plasma Processes

IP.com Disclosure Number: IPCOM000037731D
Original Publication Date: 1989-Jun-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Mlynko, WE: AUTHOR [+2]

Abstract

Customarily, destructive methods have been used to monitor plasma hole clean effectiveness, i.e., the removal of drill smear. This practice is costly and time consuming. What is needed and what is provided by the present optical system is a real time, automatable process monitor for plasma hole clean applications. Moreover, the present system also is non-destructive.

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Optical System for Monitoring Plasma Processes

Customarily, destructive methods have been used to monitor plasma hole clean effectiveness, i.e., the removal of drill smear. This practice is costly and time consuming. What is needed and what is provided by the present optical system is a real time, automatable process monitor for plasma hole clean applications. Moreover, the present system also is non-destructive.

In accordance with the present system, an optical scanner is positioned to read an etchable bar code of variable thickness before plasma which is compared with the bar code remaining after plasma. Based upon this reading, the effectiveness of the etch rate and the effectiveness of the plasma run will become immediately apparent.

Disclosed anonymously.

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