Browse Prior Art Database

Ground Plane to Bonding Pad Connection for Tab

IP.com Disclosure Number: IPCOM000037738D
Original Publication Date: 1989-Jun-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Jordan, DJ: AUTHOR [+2]

Abstract

Vias or plated through holes are commonly used to connect the copper interplanes of a multilayered printed circuit board (PCB). One difficulty encountered in such a construction technique is the placement of small features (holes) in the dielectric layer of the PCB. Such holes are very difficult to make small enough to serve their designed purpose. A described technique that achieves interconnection by using a folded lead, thereby eliminating the need for the holes, works as follows.

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Ground Plane to Bonding Pad Connection for Tab

Vias or plated through holes are commonly used to connect the copper interplanes of a multilayered printed circuit board (PCB). One difficulty encountered in such a construction technique is the placement of small features (holes) in the dielectric layer of the PCB. Such holes are very difficult to make small enough to serve their designed purpose. A described technique that achieves interconnection by using a folded lead, thereby eliminating the need for the holes, works as follows.

A connection is provided at either the outer lead bond (OLB) or at the inner lead bond (ILB) by folding a lead over to the other side of the dielectric to mate with a bonding pad which is connected to the ground plane. The folded lead is connected to another lead that is used for chip or card bonding. The folded lead can be connected to the ground plane pad with solder or thermocompression bond.

The configuration is shown in a top view in Fig. 1 as it would appear before folding and in Fig. 2a after folding the lead. A side view (Fig. 2b) and a bottom view (Fig. 2c) are also provided of the folded lead.

Disclosed anonymously.

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