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Alternative Solvents for Stripping Solvent Based Riston Photoresist

IP.com Disclosure Number: IPCOM000037741D
Original Publication Date: 1989-Jun-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Bhatt, AC: AUTHOR [+5]

Abstract

Additive plating technology requires the use of solvent based Riston (Trademark of E. I. DuPont De Nemours & Co.) photoresists that have excellent resistance to alkaline media. The removal of such resist after plating is accomplished by the use of methylene chloride (MC) in a horizontal stripper. Due to environmental concerns MC may be banned in the near future. A number of other solvents can be used to replace MC, but the majority of them have been classified toxic and unsafe for use in the manufacturing environment.

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Alternative Solvents for Stripping Solvent Based Riston Photoresist

Additive plating technology requires the use of solvent based Riston (Trademark of E. I. DuPont De Nemours & Co.) photoresists that have excellent resistance to alkaline media. The removal of such resist after plating is accomplished by the use of methylene chloride (MC) in a horizontal stripper. Due to environmental concerns MC may be banned in the near future. A number of other solvents can be used to replace MC, but the majority of them have been classified toxic and unsafe for use in the manufacturing environment.

The disclosed invention consists of utilizing a number of non-toxic and safe solvents for stripping Riston type photoresist effectively. The use of low boiling solvents such as methyl chloroform (MCF), methyl ethyl ketone (MEK), xylenes or mixtures of the above should be similar to the MC stripping process. On the other hand the use of high boilers, i.e., n-methyl pyrolidone (NMP), butyrolactone (BLO), dimethyl sulfoxide (DMSO) and propylene carbonate (PC3) must be followed by a rinsing step with a compatible solvent or water.

In order to obtain dissolution times comparable to those of MC the temperature during stripping should be maintained at least at 60 +/-3~C. Temperatures lower than 60~C will result in an increase in the dissolution time and will not be as effective.

Disclosed anonymously.

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