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Improving Pin Pull Strength

IP.com Disclosure Number: IPCOM000037745D
Original Publication Date: 1989-Jun-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Kapur, S: AUTHOR [+5]

Abstract

The connection between I/O pins and a glass-ceramic substrate can be improved by increasing the bonding area between the pin head and substrate. Referring to Fig. 1, the prior art shows a substrate 10 having a metallic bonding pad 12 to which a pin 14 having head 16 is bonded. The brazed area 18 is significantly greater than the area of head 16. This results in large tensile stresses at the edge of metal pad 12 following sintering.

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Improving Pin Pull Strength

The connection between I/O pins and a glass-ceramic substrate can be improved by increasing the bonding area between the pin head and substrate. Referring to Fig. 1, the prior art shows a substrate 10 having a metallic bonding pad 12 to which a pin 14 having head 16 is bonded. The brazed area 18 is significantly greater than the area of head 16. This results in large tensile stresses at the edge of metal pad 12 following sintering.

Increasing the diameter of the head 16 to equal or exceed the diameter of the metal pad 12 will reduce the amount of braze 18 needed and decrease the tensile stresses at the perimeter of the pad.

Alternatively, referring to Fig. 3, an interposer disk 20, having a diameter slightly greater than or equal to pad 12 can achieve the same stress reduction when brazed between the pin 14 and pad 12. Interposer disk 20 can be brazed using any of the bonding techniques currently known in the art.

Disclosed anonymously.

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