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Browse Prior Art Database

Low Cost Edge Tabs for Circuit Cards And Hybrid Substrates

IP.com Disclosure Number: IPCOM000037752D
Original Publication Date: 1989-Jun-01
Included in the Prior Art Database: 2005-Jan-29
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Aakalu, NG: AUTHOR

Abstract

This scheme uses cured resistive ink directly on base metal in place of plated nickel and gold for connector pads on pluggable circuit cards and other types of electronic substrates.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

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Low Cost Edge Tabs for Circuit Cards And Hybrid Substrates

This scheme uses cured resistive ink directly on base metal in place of plated nickel and gold for connector pads on pluggable circuit cards and other types of electronic substrates.

A special filled polymer resistor ink is printed over the copper edge connector pads. The ink is then heat or ultra-violet light cured. These inks can provide up to millions of insertion cycles of life when mated with connectors on a system board. The method can be extended to other substrates such as alumina, porcelain steel, glass ceramic on steel, etc. The resistive ink is applied over thick film connector pads instead of using a gold plating process or thick film gold or other previous metals. The ink is special in that it has the necessary wear resistance and also it protects the pads underneath it from the environment. Although the ink is resistive, the electrical current path is transverse of the thin ink layer, so that little resistance is introduced.

In applications where it is possible to use the resistive ink as encapsulate, it eliminates the need for encapsulated or solder mask process steps in the manufacturing of the circuits.

Disclosed anonymously.

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