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Semiconductor Yield Management System

IP.com Disclosure Number: IPCOM000037794D
Original Publication Date: 1989-Jul-01
Included in the Prior Art Database: 2005-Jan-30
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Castrucci, PP: AUTHOR [+4]

Abstract

By automating in-process, non-destructive semiconductor device and wafer inspection, cataloging and analyzing inspection data, and relating the data to yield models; fast yield prediction and process control is achieved. A total manufacturing yield management system comprised of six interconnected measurement, assessment, and feedback control subsystems is described.

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Semiconductor Yield Management System

By automating in-process, non-destructive semiconductor device and wafer inspection, cataloging and analyzing inspection data, and relating the data to yield models; fast yield prediction and process control is achieved. A total manufacturing yield management system comprised of six interconnected measurement, assessment, and feedback control subsystems is described.

A first subsystem is comprised of automated, in-process wafer inspection stations disposed at several points in the manufacturing line. Measurement against inspection criteria for defects, pattern dimensions, and overlay is performed and data obtained is temporarily stored in this subsystem.

A second, interconnected subsystem performs cataloging and analysis functions on data from the first subsystem. Data is filed such that a system operator may obtain output catalogued by product, wafer lot, inspection level, wafer number, device type, defect type, defect size, defect location, etc. Wafers are identified for special disposition based on the data. This second subsystem acts also as a conduit for data to a third subsystem and to update the first subsystem sampling and inspection criteria.

A third subsystem provides mass storage for data from the second subsystem and develops yield algorithms for each manufactured product. As inspection data is correlated with device yield, inspection criteria are changed and/or sampling plans are updated and immediately passed th...