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Browse Prior Art Database

Shorts Defective Isolation Method

IP.com Disclosure Number: IPCOM000037808D
Original Publication Date: 1989-Jul-01
Included in the Prior Art Database: 2005-Jan-30
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Banikazemi, R: AUTHOR

Abstract

The protective coating on printed circuit cards or boards cover external lines eliminate solder bridge defects at assembly level and surface shorts. Insulation resistance defects occur in absence of pro-coat between any two adjacent conductors when the product is under environmental conditions, i.e., 50 degrees C and 80% humidity. The leakage defect disappears when the product is brought back to the ambient conditions. This defect isolation method will help to locate defects for failure analysis, and includes the following steps: 1) Trace the two printed circuit conductors to identify surface short risks. 2) Bias the conductors using a 60 volt DC, 10 ma source. 3) Apply ionized solution, such as salt water at the risk sites. 4) Permit 5-10 minutes to grow copper between the two exposed conductors along the void path.

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Shorts Defective Isolation Method

The protective coating on printed circuit cards or boards cover external lines eliminate solder bridge defects at assembly level and surface shorts. Insulation resistance defects occur in absence of pro-coat between any two adjacent conductors when the product is under environmental conditions, i.e., 50 degrees C and 80% humidity. The leakage defect disappears when the product is brought back to the ambient conditions. This defect isolation method will help to locate defects for failure analysis, and includes the following steps: 1) Trace the two printed circuit conductors to identify surface short risks. 2) Bias the conductors using a 60 volt DC, 10 ma source. 3) Apply ionized solution, such as salt water at the risk sites. 4) Permit 5-10 minutes to grow copper between the two exposed conductors along the void path.

Insulation resistance will reduce to a low, measurable value, 10-30 K ohms, at room conditions. Then, it is possible to study the cause of failure.

Disclosed anonymously.

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