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Finned Heat Sink for Chips Enclosed in Dielectric Coolant

IP.com Disclosure Number: IPCOM000037826D
Original Publication Date: 1989-Jul-01
Included in the Prior Art Database: 2005-Jan-30
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Agonafer, D: AUTHOR [+4]

Abstract

In some circuits modules, semiconductor chips are mounted in an array on a surface of a substrate that is uppermost in an arbitrary orientation. A cover plate is located above the substrate and cooperates with the substrate to form an enclosure for the chips. A coolant flows through the enclosure to cool the chips.

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Finned Heat Sink for Chips Enclosed in Dielectric Coolant

In some circuits modules, semiconductor chips are mounted in an array on a surface of a substrate that is uppermost in an arbitrary orientation. A cover plate is located above the substrate and cooperates with the substrate to form an enclosure for the chips. A coolant flows through the enclosure to cool the chips.

Each chip has a heat sink that includes a thin square metal plate that is an appropriate size to overlie the chip. The plate has an extended heat transfer surface such as pin fins mounted in an array on the upper surface of the plate. The pins extend upwardly to just below the cover plate. One or more springs are arranged to hold the plate against the chip. For example, one spring is located between each corner pin and the cover plate to hold the metal plate against its chip. A small pin is attached to the cover plate and fits loosely in a hole in the top of a pin fin to locate the heat sink laterally. In one implementation, the cover plate has recesses that each receive the upper end of a coil spring. The lower end of the coil spring rests on the top of the pin fin. A locating pin is located inside the coil spring for each corner pin.

Disclosed anonymously.

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