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Thermocompression Bonded High Density Cable Design

IP.com Disclosure Number: IPCOM000037847D
Original Publication Date: 1989-Jul-01
Included in the Prior Art Database: 2005-Jan-30
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Bradshaw, RL: AUTHOR [+3]

Abstract

A cable design consisting of conduction leads (A) deposited on a flexible substrate (B) (polyimide or polyester) using photolithographic technology and contained in a thermosetting, thermoplastic insulating matrix (D) permits high density cable construction (see figure). The resulting cable, in addition to its high density of conductors, is by design stress relieved during the thermocompression bonding process and improves manufacturability by permitting thermocompression bonding through the substrate.

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Thermocompression Bonded High Density Cable Design

A cable design consisting of conduction leads (A) deposited on a flexible substrate (B) (polyimide or polyester) using photolithographic technology and contained in a thermosetting, thermoplastic insulating matrix (D) permits high density cable construction (see figure). The resulting cable, in addition to its high density of conductors, is by design stress relieved during the thermocompression bonding process and improves manufacturability by permitting thermocompression bonding through the substrate.

Key components in the invention are the process of thermocompression bonding which such a thermosetting, thermoplastic, matrix permits and the materials useful in constructing the insulating matrix. Materials potentially useful for the thermoplastic, thermosetting matrix are graft copolymers and copolymers of polyimide-acrylates and methacrylates, epoxy-acrylates and methacrylates as well as silicone-epoxy and silicone-epoxy- acrylates. The key requirements of the matrix material are its coatability, photocure to a rubbery mask, and thermal cure to a crosslinked network or glass.

The preferred cable would contain a thin overcoat (C) of the thermosetting, thermoplastic which would then permit mechanical filling of the thermocompression bonded closure thus preventing corrosion and void formation.

Disclosed anonymously.

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