Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Dry Lithographic Process

IP.com Disclosure Number: IPCOM000037850D
Original Publication Date: 1989-Jul-01
Included in the Prior Art Database: 2005-Jan-30
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Lin, BJ: AUTHOR [+3]

Abstract

This article relates generally to integrated circuit construction and, more particularly, to a process of defining submicron features by a dry lithographic process.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Dry Lithographic Process

This article relates generally to integrated circuit construction and, more particularly, to a process of defining submicron features by a dry lithographic process.

The number of steps required for the usual wet lithographic process can be decreased and improved edge definition and resolution of submicron features can be achieved by using a two-layer dry process, as follows: 1. Polyimide is deposited on a substrate surface by either the spin-on technique or vapor deposition. Better uniformity, low defect density and good adhesion are obtained with the latter. 2. A photosensitive compound is deposited over the polyimide by vacuum sublimation. Suitable compounds are derivatives of O- nitrobenzaldehyde, esterified phenol or diazoquinone. 3. The photosensitive compounds are then masked and exposed to ultraviolet light to form the desired patterns. 4. After mask removal, the exposed substrate surface is subjected to a vaporized silylating agent such as hexamethyldisilazane (HMDS). Silylation replaces the reactive hydrogens with a trimethylsilyl group. 5. The silylated surface is next subjected to oxygen plasma that converts those areas that have been exposed to ultraviolet light into silicon dioxide film. The film serves as a barrier to subsequent etching procedures for the underlying organic layer.

Disclosed anonymously.

1