Browse Prior Art Database

Solder Cooling Technique

IP.com Disclosure Number: IPCOM000037879D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-30
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Vittone, JM: AUTHOR [+2]

Abstract

Circuit board solder joints reflowed by the vapor phase of a material can be cooled at a beneficially controlled rate by spraying the boards with the same working fluid in its liquid state.

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Solder Cooling Technique

Circuit board solder joints reflowed by the vapor phase of a material can be cooled at a beneficially controlled rate by spraying the boards with the same working fluid in its liquid state.

In the drawing, multilayer interconnection boards 1 with surface mount components thereon are moved by conveyor 7 on rail 8 through pre-heat station 2 to vapor phase reflow station 3. At this station, the boards are stopped for a period sufficient for the heat of a vaporized fluorocarbon liquid such as flourinert at 215 C to heat and reflow the previously solder coated joints. The board is then moved to spray station 4 where the fluorinert liquid at room temperature is sprayed from nozzle 5 on the underside of the board to cool the reflowed joints. The cool liquid and its transformation to a gas enhances the board cooling. By regulating the liquid spray, the cooling of the board can be controlled to provide an optimum cooling rate for the solder through its critical solidification range. Condensed vapor can be returned to the liquid supply 6 at the tank bottom for subsequent vaporization.

Disclosed anonymously.

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