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Browse Prior Art Database

Solder Ring Retention Clip

IP.com Disclosure Number: IPCOM000037880D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-30
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Bongiorno, PJ: AUTHOR [+3]

Abstract

Solder rings can be retained temporarily on staggered connector pins prior to reflow by using a U-shaped spring clip with angularly disposed slots that each accept a plurality of ringed pins.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

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Solder Ring Retention Clip

Solder rings can be retained temporarily on staggered connector pins prior to reflow by using a U-shaped spring clip with angularly disposed slots that each accept a plurality of ringed pins.

In the figures, connector 1, shown in phantom, has three rows of pins 2 extending from its top surface. The pins in one row are offset or staggered with respect to pins in the other rows. Preformed solder rings (not shown) are placed over each pin on the top surface and retained in place by sliding U-shaped slotted clip 3 of thin, resilient material over the rings and connector bottom. Slots 4 are disposed at an acute angle relative to the connector axis and accept one pin from each row to retain the respective rings adjacent to the connector. The connector is then inverted, the pins inserted in a printed wiring board, and the clip removed. The solder rings can now be reflowed.

Disclosed anonymously.

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