Browse Prior Art Database

Edge-of-Wafer Expose System for Clearing Photoresist From Wafers

IP.com Disclosure Number: IPCOM000037890D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-30
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Badalamenti, JP: AUTHOR [+4]

Abstract

It is proposed to use an UV light emitting optical fiber bundle to locally expose excess photoresist (PR) near the edges and undersides of semiconductor wafers. This will serve to minimize contamination problems which may otherwise occur during handling and processing of the wafers.

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Edge-of-Wafer Expose System for Clearing Photoresist From Wafers

It is proposed to use an UV light emitting optical fiber bundle to locally expose excess photoresist (PR) near the edges and undersides of semiconductor wafers. This will serve to minimize contamination problems which may otherwise occur during handling and processing of the wafers.

The movable fiber bundle 1 of Fig. 1 would be attached to the apply/spin PR coating tool by means of a rigid arm support 2 and an extension-retraction motor
3. This would be used to position the fiber bundle relative to the wafer 4 being rotated by the spin chuck 5. A remote UV source 6 would provide light through the fiber. The flooding of the residual PR with UV light would effectively allow cleaning of the wafer of the undesired PR.

In a possible apply/spin program PR would be first applied to the wafer which would then undergo a spread spin and thickness spin. The optical fiber head would next be extended to expose the spinning edge of the wafer for about 20 sec. so as to remove the excess PR. The head would be retracted and the wafer unloaded for further processing.

The undesired photoresist could then be easily removed either by: a) The normal developing step of the subsequently lithographically pattern exposed wafer, or b) An extra immersion edge developing process step, where the resist would be removed before the wafer was handled by the pattern expose (lithography tool), or by c) A rotating chucked-wafer spray...