Browse Prior Art Database

Decals Made With Pre-Metallized Polyimide Film

IP.com Disclosure Number: IPCOM000037914D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-30
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Goubau, WM: AUTHOR [+2]

Abstract

The use of metallized polyimide decals in interconnecting wiring for semiconductor chips can be extended to very thin, of the order of 1/4 mil thickness polyimide films by mounting the film for processing on a frame having a low thermal expansion coefficient such as stainless steel, heating the film to between 350 and 400oC to cause shrinkage which results in tensioning. A metallization step is avoided by premetallization. The freedom from pin holes and dielectric properties may be tested using electrical probes prior to patterning of the metal films.

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Decals Made With Pre-Metallized Polyimide Film

The use of metallized polyimide decals in interconnecting wiring for semiconductor chips can be extended to very thin, of the order of 1/4 mil thickness polyimide films by mounting the film for processing on a frame having a low thermal expansion coefficient such as stainless steel, heating the film to between 350 and 400oC to cause shrinkage which results in tensioning. A metallization step is avoided by premetallization. The freedom from pin holes and dielectric properties may be tested using electrical probes prior to patterning of the metal films.

A schematic of the structure is shown in the figure.

Disclosed anonymously.

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