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Thermal Conduction Module (TCM) with Water Circulated Through Pistons

IP.com Disclosure Number: IPCOM000037929D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-31
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Chrysler, GM: AUTHOR [+5]

Abstract

A known circuit module called the TCM provides water cooling for semiconductor chips that are carried in an array on a planar substrate. The module will be described in an arbitrary orientation with the substrate in a horizontal plane and the chip carrying surface facing up. Cylindrical pistons are located over the substrate in a structure called a hat and slide downward into heat transfer contact with the upper surfaces of the chips. The hat cooperates with the substrate to form an enclosure for the chips. Commonly, the hat is cooled by chilled water. In a new module, chilled water is circulated through the pistons.

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Thermal Conduction Module (TCM) with Water Circulated Through Pistons

A known circuit module called the TCM provides water cooling for semiconductor chips that are carried in an array on a planar substrate. The module will be described in an arbitrary orientation with the substrate in a horizontal plane and the chip carrying surface facing up. Cylindrical pistons are located over the substrate in a structure called a hat and slide downward into heat transfer contact with the upper surfaces of the chips. The hat cooperates with the substrate to form an enclosure for the chips. Commonly, the hat is cooled by chilled water. In a new module, chilled water is circulated through the pistons.

In one embodiment the pistons are in the form of a metal cup. A thin plate is mounted above the substrate with a shallow space between the chips and the lower surface of the plate. The plate has holes positioned over the chips, and the cups sit in the holes with the bottom of the cup in heat transfer contact with a chip. The tops of the cups extend above the upper surface of the plate. A bellows extends from the upper edge of the cup to the upper surface of the thin plate and seals the chip space below the plate from a coolant space above the plate.

A water supply manifold is located above the plate, and the space outside the manifold is enclosed to form a water return channel. Tubes extend from the supply manifold into each cup and direct a jet of water to impinge against the insi...