Browse Prior Art Database

Rigid Carrier Surface for High Temperature Lamination

IP.com Disclosure Number: IPCOM000037938D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-31
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Ballard, GL: AUTHOR [+2]

Abstract

A stainless steel rigid carrier when laminated at 170 degrees C (340 degrees F) will release the copper from the stainless steel rigid carrier easily. At temperatures above 170 degrees C (340 degrees F) up to 390 degrees C (730 degrees F) an alloying bond takes place and the copper cannot be stripped from the stainless steel rigid carrier.

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Rigid Carrier Surface for High Temperature Lamination

A stainless steel rigid carrier when laminated at 170 degrees C (340 degrees
F) will release the copper from the stainless steel rigid carrier easily. At temperatures above 170 degrees C (340 degrees F) up to 390 degrees C (730 degrees F) an alloying bond takes place and the copper cannot be stripped from the stainless steel rigid carrier.

When a thin chromium layer is deposited on the stainless steel, rigid copper can be stripped easily after elevated laminating temperatures.

Anonymous.

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