Browse Prior Art Database

Module Assembly Process

IP.com Disclosure Number: IPCOM000037970D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-31
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Ameen, JG: AUTHOR [+3]

Abstract

The following process encapsulates a standard module assembly (SMA) to provide a hermetic seal to protect the SMA against the environment in which the device is to be used.

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Module Assembly Process

The following process encapsulates a standard module assembly (SMA) to provide a hermetic seal to protect the SMA against the environment in which the device is to be used.

As shown in the figure, chip 1 is joined to substrate 2 and Sylgard 3 (*) is dispensed to cover the area under and on top of the chip. The Sylgard is then cured.

An aluminum plate 4 is placed on the Sylgard directly over the chip. A weight of up to 4 lbs. may be added on top of the plate to hold it in place if necessary.

Dispense Scotchcast 5 (**) over the remaining area of the substrate not covered by the plate. Cure the Scotchcast.

Because of the Sylgard's presence, the Scotchcast will be prevented from wicking under the plate in the vicinity of the chip. The aluminum plate acts as a heat fin facilitating heat removal. Only low stress is placed on the chip during thermocycling if the aluminum plate is kept thin. If necessary, non-conducting standoffs, e.g., epoxy beads, may be incorporated into the aluminum plate to guarantee planarity if thin foil aluminum is used. * Trademark of the Dow Corning Corp. ** Trademark of the 3M Co.

Disclosed anonymously.

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