Browse Prior Art Database

Decal Module Cap Bonding Method

IP.com Disclosure Number: IPCOM000037971D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-31
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Kresge, JS: AUTHOR [+2]

Abstract

A decal module is constructed by bonding the decal and a chip to a metal cap. The following information relates to a method of accomplishing this bonding, and in addition achieves electrical isolation, low thermal path between the chip and the cap (the cap also acts as a heat sink) and material compatibility.

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Decal Module Cap Bonding Method

A decal module is constructed by bonding the decal and a chip to a metal cap. The following information relates to a method of accomplishing this bonding, and in addition achieves electrical isolation, low thermal path between the chip and the cap (the cap also acts as a heat sink) and material compatibility.

As shown in the drawing, the metal cap 1 is coated with a thin layer of polyimide 2 (which is the same material as the dielectric used in the decal). The polyimide 2 is partially cured and will act as the adhesive to bond the decal 3 and the chip 4 to the metal cap 1.

The decal, with the chip attached, is now pressed in place to the metal cap. Heat is applied to complete the curing of the polyimide and finish the bonding.

Disclosed anonymously.

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