Browse Prior Art Database

Solder Bridge Prevention During Wave Soldering Process

IP.com Disclosure Number: IPCOM000037979D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-31
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Senger, RC: AUTHOR

Abstract

In some instances, during wave soldering of PC boards, unwanted solder bridges are formed between closely spaced connector pins. The resulting undesired connections must thereafter be removed by manual touch up or reworking methods.

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Solder Bridge Prevention During Wave Soldering Process

In some instances, during wave soldering of PC boards, unwanted solder bridges are formed between closely spaced connector pins. The resulting undesired connections must thereafter be removed by manual touch up or reworking methods.

The formation of such bridges can be prevented by incorporating a solder- collecting device on the PC boards, which trails the connector pins, with respect to the processing direction of the cards moving through the wave-soldering process.

As shown in the drawing, a copper strip or bar 1 is located on the card so that the bar follows the connector pins 3 as the card moves through the wave solder bath. The dimensions of the bar and its spacing from the connecting pins are selected and proportioned so that a wicking action occurs as the pins leave the bath, whereby the solder wicks to and snaps back to the bar rather than snapping the connecting pins and forming undesired solder bridges.

Disclosed anonymously.

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