Browse Prior Art Database

Conformal Coat for Thin Film Chip Carriers

IP.com Disclosure Number: IPCOM000037984D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-31
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Ameen, JG: AUTHOR [+4]

Abstract

This disclosure describes an alternative to "glob-top" coating devices on thin film carriers.

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This is the abbreviated version, containing approximately 100% of the total text.

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Conformal Coat for Thin Film Chip Carriers

This disclosure describes an alternative to "glob-top" coating devices on thin film carriers.

It is common practice for thin film chip carriers to use an epoxy or silicone "glob-top" encapsulant over the integrated circuit (IC) chip to protect the device from the environment. Silicones are preferred because of their low flexural strength but are not very solvent resistant. Epoxies are solvent resistant but suffer from high flexural strength that oftentimes induce enough stress to cause chip failures especially where large chips are concerned. Also, sometimes the circuitry on the thin film carrier is just as sensitive to the environment as the circuitry on the device itself. A total module encapsulation would be desirable preferably with an epoxy since solvent cleaning is usually part of the process. To achieve a totally protected package, and minimize the effects of high flexural strength materials, a thin epoxy coating is sprayed over the chip and thin film. If the coating thickness is kept to about 1 - 2 mils, the effects of the epoxy's flexural strength are minimized providing a cost effective method for coating both the module and chip resulting in a near hermetic, solvent resistant, reliable package.

Disclosed anonymously.

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